Ir. Dr. M.Z. Abdullah (https://www.researchgate.net/profile/MZ_Abdullah) has been a professor of mechanical engineering at Universiti Sains Malaysia since 2010. He obtained his B.S. degree in mechanical engineering from the University of Swansea, UK. He took up his MSc and Ph.D. degrees from the University of Strathclyde, UK. He has numerous publications in international journals and conference proceedings. His areas of research are CFD, heat transfer, electronic packaging, electronic cooling, and porous medium combustion. He has successfully established collaborations with Intel Technology (M) Sdn. Bhd., Celestica (M) Sdn. Bhd., and Jabil Circuits (M) Sdn. Bhd. in the areas of electronic packaging and surface mount technology. He is also involved in consultancy work with five companies in Malaysia related to his field of expertise. He has been invited to give keynote lectures at University of Manipal in India, National Institute of Technology in Calicut, India, University of Tarumanangara in Jakarta, Indonesia, University of Kuala Lumpur (MSI) in Kedah, Malaysia, and Intel Technology (M) Sdn. Bhd. in Penang, Malaysia. Ir. Dr. Abdullah has supervised 21 Ph.D. and more than 30 MSc students. Currently, he is supervising seven Ph.D. students in his research laboratory. He was the recipient of the Outstanding Paper Award 2013 conferred by Emerald Group Publishing Limited in the journal of Soldering and Surface Mount Technology.

Mohd Zulkifly Abdullah School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Palau Pinang, Malaysia

Ir. Dr. M.Z. Abdullah (https://www.researchgate.net/profile/MZ_Abdullah) has been a professor of mechanical engineering at Universiti Sains Malaysia since 2010. He obtained his B.S. degree in mechanical engineering from the University of Swansea, UK. He took up his MSc and Ph.D. degrees from the University of Strathclyde, UK. He has numerous publications in international journals and conference proceedings. His areas of research are CFD, heat transfer, electronic packaging, electronic cooling, and porous medium combustion. He has successfully established collaborations with Intel Technology (M) Sdn. Bhd., Celestica (M) Sdn. Bhd., and Jabil Circuits (M) Sdn. Bhd. in the areas of electronic packaging and surface mount technology. He is also involved in consultancy work with five companies in Malaysia related to his field of expertise. He has been invited to give keynote lectures at University of Manipal in India, National Institute of Technology in Calicut, India, University of Tarumanangara in Jakarta, Indonesia, University of Kuala Lumpur (MSI) in Kedah, Malaysia, and Intel Technology (M) Sdn. Bhd. in Penang, Malaysia. Ir. Dr. Abdullah has supervised 21 Ph.D. and more than 30 MSc students. Currently, he is supervising seven Ph.D. students in his research laboratory. He was the recipient of the Outstanding Paper Award 2013 conferred by Emerald Group Publishing Limited in the journal of Soldering and Surface Mount Technology.

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