Thermal Stresses: Design, Behavior and Applications


Alfred R. Webb (Editor)

Series: Materials Science and Technologies
BISAC: TEC021000

Thermal stresses which originate as a consequence of different thermal expansion coefficients of components of multi-component materials represent an important phenomenon in multi-component materials. These stresses are usually investigated by computational and experimental methods are still of interest to materials scientists and engineers. In this book, the design, behavior and applications of thermal stresses are discussed. Chapter One introduces a full three-dimensional, non-isothermal computational fluid dynamics (CFD) model of an operating PEM fuel cell which was developed to simulate the thermal stresses inside the cell. Chapter Two deals with mutual comparison of different analytical models of thermal stresses in a multi-particle-matrix system with isotropic spherical particles which are periodically distributed in an isotropic infinite matrix. Chapter Three deals with an analytical model of thermal stresses originating during a cooling process of an anisotropic solid elastic continuum. Chapter Four provides an analysis on thermal loads of nozzle in low-temperature reactor piping. Chapter Five investigates the influence of the thermal stresses on the performances of the integrated-planar solid oxide fuel cell IP-SOFC and essentially the durability of the cell elements which is a major technical barrier to the commercial viability. Chapter Six studies the amino nitrogen metabolism of Saccharomyces cerevisiae as it is protected by SO2 under thermal stress. (Imprint: Nova)

Table of Contents

Table of Contents


Chapter 1. Design Optimization of PEM Fuel Cells to Minimize the Maximum Thermal Stress
Maher A. R. Sadiq Al-Baghdadi (Fuel Cell Research Center, International Energy and Environment Foundation (IEEF), Najaf, Iraq)

Chapter 2. Energy Analysis of Analytical Models of Thermal Stresses in Composite Materials
Ladislav Ceniga (Institute of Materials Research, Slovak Academy of Sciences, Kosice, Slovak Republic)

Chapter 3. Analytical Model of Thermal Stresses and Crack Formation in Two-Component Anisotropic Materials
Ladislav Ceniga (Institute of Materials Research, Slovak Academy of Sciences, Kosice, Slovak Republic)

Chapter 4. Analysis on Thermal Loads of Nozzle in Low-Temperature Reactor Piping
Dai Shoutong, Wang Zhihao, Zhang Jinshan and Dai Changnian (China Institute of Atomic Energy, Beijing, China)

Chapter 5. Effect of Thermal Stress on the Performances of the Multi-Bundle Integrated-Planar Solid Oxide Fuel Cells IP-SOFC
Hamid Mounir (Mohammadia School of Engineering, Mohamed V University, Maroc, Africa)

Chapter 6. Amino Nitrogen Metabolism of Saccharomyces cerevisiae was Protected by SO2 under Thermal Stress
Carmen Ancín-Azpilicueta, Blanca Barriuso-Esteban, Nerea Jiménez-Moreno and Asunción Luquin (Departamento de Química Aplicada, Universidad Pública de Navarra, Campus Arrosadía, Pamplona, Spain)


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