Simulation of Deposition Processes with PECVD Apparatus: Theory and Applications

Juergen Geiser and Meraa Arab
Humboldt University of Berlin, Berlin, Germany

Series: Materials Science and Technologies
BISAC: TEC021000

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$87.00

Volume 10

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Special issue: Resilience in breaking the cycle of children’s environmental health disparities
Edited by I Leslie Rubin, Robert J Geller, Abby Mutic, Benjamin A Gitterman, Nathan Mutic, Wayne Garfinkel, Claire D Coles, Kurt Martinuzzi, and Joav Merrick

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This book discusses the study of simulating the growth of a thin film by chemical vapor deposition (CVD) processes. In recent years, due to the research in producing high-temperature films by depositing low pressures, the processes have increased and understanding the control mechanism of such processes has become very important. An underlying hierarchy of models for low-temperature and low-pressure plasma is presented in order to discuss the processes that can be used to implant or deposit thin layers of important materials. Due to the multi-scale problem of the flow and reaction processes, the authors propose multi-scale problems which are divided into near-field and far-field models. (Imprint: Nova)

Preface

1. Introduction

2. Modeling

3. Mathematical Methods

4. Numerical Experiments

5. Conclusion

Bibliography

Index

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