Properties and Applications of Polyimides

$160.00 – $252.00

Changwei Liu, PhD – Professor, Polymer Science, Institute of Petro chemistry, Heilongjiang Academy of Science, Harbin, China

Series: Polymer Science and Technology
BISAC: SCI013040;TEC021000; SCI097000
DOI: https://doi.org/10.52305/NUNO3180

Polyimide (PI) is a polymer with an imide ring structure in the backbone. As an important high-performance polymer, PI has been widely used in the aerospace and microelectronics industries due to its excellent thermal stability, mechanical properties, dimensional stability, chemical resistance, and insulation properties. Some typical applications of PI include high-temperature resistant coatings for spacecraft, structural support materials for light spacecraft, solar cell substrates, flexible printed circuit boards, and insulation layers for large integrated circuits. This book provides research on the properties and applications of PI-based materials. Chapter 1 discusses that the development of PI aerogel materials in the past decades has generated great interest in new transformation, selective functionalization and environmentally sustainable development. The research and application progress of PI aerogel materials in thermal insulation, low dielectric, hydrophobic, environmental remediation and other aspects were reviewed. Chapter 2 summarizes the latest progress in the field of PI-based thermal conductive materials, summarizes the general rules of the formation of thermal channels in composites, and introduces the latest progress of PI-based thermal conductive films obtained after graphitization, hoping to provide some guidance for the future research of thermal conductive PI materials. In the third chapter, the application of PI adhesive in the bonding of metal, battery and hybrid materials is introduced, and the influence of molecular structure on the bonding performance is analyzed. This chapter evaluates the effect of structure on properties and explains the macroscopic properties of these adhesives according to their microstructure.

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Table of Contents

Preface

Chapter 1. The Functionalization and Applications of Polyimide Aerogels
Zhen Fan, Changwei Liu, PhD and Dezhi Wang, PhD
Institute of Petro Chemistry, Heilongjiang Academy of Science, Harbin, China

Chapter 2. Thermal Conductivity Enhancement of Polyimide and Polyimide Composites
Junyu Zhao¹, PhD, Hongwei Zhou¹, PhD, Xiaogang Zhao¹, PhD and Chunhai Chen², PhD
¹Key Laboratory of High Performance Plastics, Ministry of Education, National and Local Joint Engineering Laboratory for Synthetic Technology of High Performance Polymer, College of Chemistry, Jilin University, Changchun, China
²Center for Advanced Low-Dimension Materials, State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai, China

Chapter 3. Temperature-Resistant Polyimide Adhesives
Daoxiang Zhao¹,², PhD and Ning Ma¹,², PhD
¹College of Materials Science and Chemical Engineering, Harbin Engineering University, Harbin, China
²Qingdao Innovation and Development Base, Harbin Engineering University, Qingdao, China

Index

Editor’s ORCID iD

Changwei Liu– 0000-0003-2367-5564

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