Table of Contents
Table of Contents
1. Introduction
2. Developing The Interconnecting Pattern
3. Testing the Alternative PCB in Industrial Environment
4. Discussion
5. Conclusion
6. References
Index
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Alan Ryan
University of Limerick, Ireland
Series: Environmental Science, Engineering and Technology, Waste and Waste Management
BISAC: SCI026000
This book presents an examination of the required printing parameters, an investigation into the effect of substrate surface roughness on performance of the interconnecting pattern for single sided PCBs, a review of compatibility with existing production equipment and outlines the ability of the developed PCB to meet the required industrial standards. This examination will illustrate the steps required to open the possibility of producing a WEEE/RoHS compliant environment-friendly PCB. (Imprint: Nova)
Table of Contents
1. Introduction
2. Developing The Interconnecting Pattern
3. Testing the Alternative PCB in Industrial Environment
4. Discussion
5. Conclusion
6. References
Index
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